Organic light emitting diode display

ABSTRACT

An organic light emitting diode display includes a first substrate, an organic light emitting element, a sealant, and a second substrate. The first substrate includes a first groove disposed in a display area of the organic light emitting diode display and a second groove disposed outside the display area. The organic light emitting element is at least partially disposed in the first groove. The sealant is at least partially disposed in the second groove. The second substrate is disposed on the first substrate. The organic light emitting element is sealed between the first substrate and the second substrate via at least the sealant.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2013-0085306, filed on Jul. 19, 2013, which isincorporated by reference for all purposes as if set forth herein.

BACKGROUND

1. Field

Exemplary embodiments relate to display technology, and, moreparticularly, to organic light emitting diode displays.

2. Discussion

Organic light emitting diode displays are a type of self-emissivedisplay that can generate light without an independent light source, asopposed to liquid crystal displays. In this manner, organic lightemitting diode displays may be more thin and lighter than conventionalnon-self-emissive displays. Further, organic light emitting diodedisplays may consume relatively lower amounts of power, producerelatively higher amounts of luminance, and respond more quickly tochanging images. Conventional organic light emitting diode displaystypically include a first substrate, an organic light emitting diode(OLED) disposed on the first substrate, a second substrate opposite thefirst substrate with the OLED disposed therebetween. In this manner, asealant, such as a frit, may be utilized to couple (e.g., cohere andseal) the first substrate and the second substrate together to, forexample, protect the OLED from external contaminants. It is noted,however, that an overall thickness of an organic light emitting diodedisplay may be increased due to the thickness of the OLED and/or thesealant.

The above information disclosed in this Background section is only forenhancement of understanding of the inventive concept, and, therefore,it may contain information that does not form the prior art that isalready known in this country to a person of ordinary skill in the art.

SUMMARY

Exemplary embodiments provide an organic light emitting diode displaythat is thinner than conventional organic light emitting diode displays.

Additional aspects will be set forth in the detailed description whichfollows and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concept.

According to exemplary embodiments, an organic light emitting diodedisplay, includes: a first substrate including a first groove disposedin a display area of the organic light emitting diode display and asecond groove disposed outside of the display area; an organic lightemitting element at least partially disposed in the first groove; asealant at least partially disposed in the second groove; and a secondsubstrate disposed on the first substrate. The organic light emittingelement is sealed between the first substrate and the second substratevia at least the sealant.

According to exemplary embodiments, a display device, includes: a firstsubstrate including a first groove disposed in a display area and asecond groove disposed outside of the display area; a light emittingelement at least partially disposed in the first groove; a sealant atleast partially disposed in the second groove; and a second substratedisposed on the first substrate. The sealant couples the first substrateand the second substrate together to seal the light emitting elementbetween the first substrate and the second substrate.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concept and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concept, and together with the descriptionserve to explain principles of the inventive concept.

FIG. 1 is a schematic plan view of an organic light emitting diodedisplay, according to exemplary embodiments.

FIG. 2 is a cross-sectional view of the organic light emitting diodedisplay of FIG. 1 taken along sectional line II-II, according toexemplary embodiments.

FIG. 3 is a cross-sectional view of an organic light emitting diodedisplay, according to exemplary embodiments.

FIG. 4 is a cross-sectional view of an organic light emitting diodedisplay, according to exemplary embodiments.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers, and/or sections, theseelements, components, regions, layers, and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the present disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” comprising,” “includes,” and/or “including,” whenused in this specification, specify the presence of stated features,integers, steps, operations, elements, components, and/or groupsthereof, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the drawings are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a schematic plan view of an organic light emitting diodedisplay, according to exemplary embodiments. FIG. 2 is a cross-sectionalview of the organic light emitting diode display of FIG. 1 taken alongsectional line II-II.

As shown in FIGS. 1 and 2, the organic light emitting diode display(ordisplay) 1000 may include a display area DA to display an image, and anon-display area NDA that may at least partially surround the displayarea DA. To this end, the display 1000 may include a first substrate100, an organic light emitting element 200, a sealant 300, a getter 400,and a second substrate 500. Although specific reference will be made tothis particular implementation, it is also contemplated that display1000 may embody many forms and include multiple and/or alternativecomponents.

According to exemplary embodiments, the first substrate 100 and thesecond substrate 500 may be formed of any suitable insulating substratematerial, such as, for example, glass, quartz, ceramic, metal, plastic,and/or the like. It is noted that when the first substrate 100 and thesecond substrate 500 are made of plastic, the display 1000 may be aflexible, stretchable, and/or rollable display. When, for instance, thefirst substrate 100 and the second substrate 500 are made of glass, aportion of a first surface 101 of the first substrate 100 correspondingto the non-display area NDA may be brought into contact with acorresponding portion of a second surface 501 of the second substrate500. It is noted that the portions of the first surface 101 of the firstsubstrate 100 and the second surface of the second substrate 500 thatare brought into contact with one another may be optically polished tofunction as optical surfaces.

In exemplary embodiments, the first substrate 100 may include a firstgroove 110, a second groove 120, and a third groove 130. The firstgroove 110 may be a recess in the first substrate 100 that is formed incorrespondence with the display area DA. In this manner, the organiclight emitting element 200 may be disposed in the first groove 110. Thesecond groove 120 may form another recess in the first substrate 100.The second groove may be formed in the non-display area NDA. It is notedthat the second groove 120 may surround the first groove 110. To thisend, the sealant 300 may be disposed in the second groove 120. The thirdgroove 130 may be yet another recess in the first substrate 100 that isformed in the non-display area NDA between the first groove 110 and thesecond groove 120. That is, the third groove 130 may be disposed betweenthe first groove 110 and the second groove 120, and, thereby, maysurround the first groove 110. The getter 400 may be disposed in thethird groove 130.

As previously mentioned, the organic light emitting element 200 may bedisposed in the first groove 110, which may be formed in the displayarea DA of the organic light emitting diode display 1000. The organiclight emitting element 200 may be configured to emit light to facilitatethe display of images via display 1000. Although not illustrated, theorganic light emitting element 200 may include an organic emission layerdisposed between a first (e.g., lower) electrode and a second (e.g.,upper) electrode. One of the first and second electrodes may be an anodeelectrode, which may function as a hole injection electrode. The otherof the first and second electrodes may be a cathode electrode, which mayfunction as an electron injection electrode. At least one of the firstand second electrodes may be formed of a light transmissive material toenable light emitted from the organic emission layer to propagatethrough the at least one of the first and second electrodes toward anobserver (not shown).

According to exemplary embodiments, the organic emission layer may beconfigured to emit light of at least one color, such as, for example,red, green, blue, white, and the like. When the organic emission layeris configured to emit white light, one or more color filters (not shown)may be disposed in the path of emitted light to change (or otherwiseaffect) the wavelength(s) of light perceived by the observer. In otherwords, the organic light emitting element 200 may display an image byemitting light of one or more colors. It is noted that a thickness ofthe organic light emitting element 200 may be adjusted so that an uppersurface of the organic light emitting element 200 may be coplanar withor disposed below the first surface 101 of the first substrate 100. Thatis, the organic light emitting element 200 may be sized to enable theorganic light emitting element 200 to be completely disposed in thefirst groove 110.

Although not illustrated, a circuit unit may be disposed between theorganic light emitting element 200 and the first substrate 100. Acorresponding circuit unit may be provided in each of the display areaDA and non-display area NDA. In this manner, wires including one or morescan lines, data lines, driving power lines, common power lines, and/orthe like may be connected between the corresponding circuit units. Apixel circuit (not shown) including two or more switching units (e.g.,thin film transistors (TFT)) connected to one or more of the wires maybe utilized to control the emission of light via the organic lightemitting elements 200. It is noted that the pixel circuit may alsoinclude one or more capacitors and/or any other suitable component. Anysuitable circuit structure may be utilized in association with thecorresponding circuit units and the pixel circuits.

According to exemplary embodiments, the sealant 300 may include a frit,which is a high temperature melting adhesive using glass powder as amain material. It is noted that the sealant 300 may be cured to enableor enhance its effectiveness. As previously mentioned, the sealant 300may be disposed in the second groove 120 formed in the first substrate100 in the non-display area NDA. To this end, the second groove 120 maysurround the organic light emitting element 200, and, thereby, the firstgroove 110 in which the organic light emitting element 200 may bedisposed. In this manner, the sealant 300 may be disposed between thefirst substrate 100 and the second substrate 500 in the second groove120, and, thereby, configured couple the first substrate 100 to thesecond substrate 200. As such, the sealant 300 may seal (e.g.,hermitically seal) the organic light emitting element 200 in a regionbetween the first substrate 100 and the second substrate 500. Inexemplary embodiments, the sealant 300 may contain lead oxide (PbO),boron trioxide (B₂O₃), silicon dioxide (SiO₂), and/or the like. Further,the sealant 300 may contain a resin, such as, for example, an epoxy. Asseen in FIG. 2, a height of a top surface of the sealant 300 may becoplanar (or substantially coplanar) with the first surface 101 of thefirst substrate 100.

The getter 400 may be disposed between the organic light emittingelement 200 and the sealant 300 to surround the organic light emittingelement 200. As seen in FIG. 2, the getter 400 may be disposed in thethird groove 130 formed in the first substrate 100 in the non-displayarea NDA. In this manner, a top surface of the getter 400 may becoplanar (or substantially coplanar) with the first surface 101 of thefirst substrate 100. As such, the getter 400 may be disposed between thefirst substrate 100 and the second substrate 500 in the third groove130.

In exemplary embodiments, the getter 400 may react with moisture and/oroxygen existing between the first substrate 100 and the second substrate500 to remove the moisture and/or oxygen. As such, the getter 400 may beutilized to prevent (or otherwise reduce) damage to the organic lightemitting element 200 that may otherwise be caused by the moisture and/oroxygen. The getter 400 may contain any suitable material, such as, forexample, at least one of barium (Ba), calcium (Ca), magnesium (Mg),titanium (Ti), vanadium (V), zirconium (Zr), niobium (Nb), molybdenum(Mo), tantalum (Ta), thorium (Th), cerium (Ce), aluminum (Al), nickel(Ni), etc.

According to exemplary embodiments, each of the first substrate 100 andthe second substrate 500 is made of glass, and the first surface 101 ofthe first substrate 100 is coupled to the second surface 501 of thesecond substrate 500 as a result of a strong bond formed between thefirst surface 101 of the first substrate 100 (which may be opticallypolished in the non-display area NDA) that is brought into contact withthe second surface 501 of the second substrate 500 (which may also beoptically polished in the non-display area NDA). The strong bond formedbetween the second surface 501 of the second substrate 500 and the firstsurface 101 of the first substrate 100 in the non-display area NDA maybe achieved via a covalent bond acting between first moleculesassociated with the first surface 101 of the first substrate 100 andsecond molecules associated with the second surface 501 of the secondsubstrate 500, each of which may be optically polished as an opticalsurface. That is, intermolecular forces acting between the firstmolecules associated with the first surface 101 and the second moleculesassociated with the second surface 501 may cause, at least in part, astrong covalent bond between the optically polished surfaces 101 and501.

In exemplary embodiments, silica (Si_(x)O_(y)) may be utilized to formeach of the first substrate 100 and the second substrate 500. It isnoted that silica in each of the first substrate 100 and the secondsubstrate 500 may be covalently bonded to silica in the other of thefirst substrate 100 and the second substrate 500 based on an induceddipole in each of the first molecules associated with the firstsubstrate 100 and the second molecules associated with the secondsubstrate 300. In this manner, dipole-dipole forces acting between thefirst molecules and the second molecules form strong covalent bondsbetween the first molecules of the first substrate 100 and the secondmolecules of the second substrate 500.

According to exemplary embodiments, since each of the first surface 101of the first substrate 100 and the second surface 501 of the secondsubstrate 500 may be optically polished, the first surface 101 of thefirst substrate 100 and the second surface 501 of the second substrate500 may be brought in closer contact with each other due to van derWaals forces acting between the first surface 101 and the second surface501. In other words, by optically polishing the first surface 101 andthe second surface 501, dispersive adhesion between the first substrate100 and the second substrate 500 may occur. This dispersive adhesion, inturn, enables a larger number of the first modules and the secondmolecules at the interface between the first surface 101 and the secondsurface 501 to be covalently bonded. As such, the first surface 101 ofthe first substrate 100 and the second surface 501 of the secondsubstrate 500 may be more strongly bonded to one another.

According to exemplary embodiments, since the display 1000 may includethe organic light emitting element 200, the sealant 300, and the getter400 respectively disposed in the first groove 110, the second groove120, and the third groove 130, the display 1000 may be manufacturedthinner than conventional display devices. Further, the first substrate100 and the second substrate 500 may be coupled to each other by thesealant 300, and the first surface 101 of the first substrate 100 andthe second surface 501 of the second substrate 500 may be covalentlybonded to one another in the non-display area NDA. As such, deformationin the frames of the first substrate 100 and the second substrate 500 inthe non-display area NDA may be prevented or at least reduced. In otherwords, due to the configuration of the display 1000, the first substrate100 and/or the second substrate 500 may not be deformed, which mayprevent stresses from building in the display 1000. This, in turn, mayprevent (or at least lessen) the potential for damage that may otherwiseoccur upon external impact to the display 1000.

Further, according to exemplary embodiments, the first substrate 100 andthe second substrate 500 may be strongly bonded to one another viacovalent bonds formed in the non-display area NDA, as well as coupled toone another via the sealant 300. As such, external moisture, debris,etc., may be prevented from permeating into the display 1000, and,thereby, prevented from damaging or degrading the organic light emittingelement 200. To this end, while the second surface 501 and the firstsurface 101 are strongly bonded to each other to form an outer boundary,the first substrate 100 and the second substrate 500 may also be sealedtogether via the sealant 300 to form an internal boundary. In thismanner, the getter 400 may be disposed within the internal boundaryprovided by the sealant 300 to provide yet another form of internalboundary. As such, external moisture may be prevented from reaching theorganic light emitting element 200 to prevent damage and/or degradationthereof. This may improve the life-span of the organic light emittingelement 200 due to the various moisture-blocking boundaries provided bythe first substrate 100, the second substrate 500, the sealant 300, andthe getter 400.

FIG. 3 is a cross-sectional view of an organic light emitting diodedisplay, according to exemplary embodiments. It is noted that theorganic light emitting diode display (or display) 1002 of FIG. 3 issubstantially similar to the organic light emitting diode display 1000of FIG. 1. To avoid obscuring exemplary embodiment described herein,primarily differences are provided below.

As shown in FIG. 3, portions of the second surface 501 of the secondsubstrate 500 associated with the non-display area NDA may be spacedapart from the first surface 101 of the first substrate 100 by adetermined distance. In this manner, the height of the top surfaces ofthe sealant 300 and the getter 400 may each be taller than the firstsurface 101 of the first substrate 100 (or extend further towards thesecond surface 501 than the first surface 101). As such, the organiclight emitting element 200, the sealant 300, and the getter 400 may berespectively disposed in the first groove 110, the second groove 120,and the third groove 130, but may each respective extend therefrom. Evenstill, because the organic light emitting element 200, the sealant 300,and the getter 400 are at least partially recessed in the first groove110, the second groove 120, and the third groove 130, the thickness ofthe display 1002 may still be thinner than conventional display devices.

Further, according to exemplary embodiments, since the top surfaces ofthe sealant 300 and the getter 400 may be higher than that of the firstsurface 101 of the first substrate 100, the first surface 101 of thefirst substrate 100 and the second surface 501 of the second substrate500 may be separated by a determined distance. This determined distancemay be adjusted to satisfy various manufacturing processing conditions,while at the same time, enabling the manufacture of a display 1002 ofreduced thickness.

FIG. 4 is a cross-sectional view of an organic light emitting diodedisplay, according to exemplary embodiments. It is noted that theorganic light emitting diode display (or display) 1004 of FIG. 4 issubstantially similar to the organic light emitting diode display 1000of FIG. 1. To avoid obscuring exemplary embodiment described herein,primarily differences are provided below.

As seen in FIG. 4, the first groove 110, the second groove 120, and thethird groove 130 are respectively formed in each of the first substrate100 and the second substrate 500 of display 1004. In this manner, theorganic light emitting element 200 may be disposed in each of the firstgrooves 110 formed in the first substrate 100 and the second substrate500. In a similar fashion, the sealant 300 may be respectively disposedin each of the second grooves 120 formed in the first substrate 100 andthe second substrate 500. To this end, the getter 400 may berespectively disposed in each of the third grooves 130 formed in thefirst substrate 100 and the second substrate 500.

According to exemplary embodiments, since the first groove 110, thesecond groove 120, and the third groove 140 may be formed in both thefirst substrate 100 and the second substrate 500, each of the firstgrooves 110, the second grooves 120, and the third grooves 130 may bemore shallow as compared to the first groove 110, the second groove 120,and the third groove 130 of display 1000. In other words, because thefirst grooves 110, the second grooves 120, and the third grooves 130 indisplay 1004 can be more shallowly formed than in display 1000, thestructural integrity of the first substrate 100 and the second substrate500 may be maintained with respectively thinner versions of the firstsubstrate 100 and the second substrate 500. In this manner, theaggregate depth of the first grooves 110, the second grooves 120, andthe third grooves 130 in display 1004 may be substantially similar tothe depth of the first groove 110, the second groove 120, and the thirdgroove 130 formed in substrate 100 of display 1000, but the overallthickness of display 1004 may be thinner than display 1000.

As such, because the organic light emitting element 200, the sealant300, and the getter 400 are correspondingly recessed in the firstgrooves 110, the second grooves 120, and the third grooves 130 formed ineach of the first substrate 100 and the second substrate 200, thethickness of the display 1004 may be thinner than conventional displaydevices, but may also be thinner than as described in association withdisplay 1000 of FIG. 1, as the first substrate 100 and the secondsubstrate 500 may be formed thinner.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concept is not limitedto such embodiments, but rather to the broader scope of the presentedclaims and various obvious modifications and equivalent arrangements.

What is claimed is:
 1. An organic light emitting diode display,comprising: a first substrate comprising a first groove disposed in adisplay area of the organic light emitting diode display and a secondgroove disposed outside of the display area; an organic light emittingelement at least partially disposed in the first groove; a sealant atleast partially disposed in the second groove; and a second substratedisposed on the first substrate, wherein the organic light emittingelement is sealed between the first substrate and second substrate viaat least the sealant.
 2. The organic light emitting diode display ofclaim 1, wherein: the first substrate further comprises a third groovedisposed between the first groove and the second groove; and the organiclight emitting diode display further comprises a getter at leastpartially disposed in the third groove.
 3. The organic light emittingdiode display of claim 2, wherein each of the second groove and thethird groove surrounds the first groove.
 4. The organic light emittingdiode display of claim 3, wherein each of the sealant and the gettersurrounds the organic light emitting element.
 5. The organic lightemitting diode display of claim 1, wherein at least one surface of thefirst substrate disposed outside the display area and at least onesurface of the second substrate disposed outside the display areacontact one another.
 6. The organic light emitting diode display ofclaim 5, wherein each of the first substrate and the second substratecomprises glass.
 7. The organic light emitting diode display of claim 6,wherein the at least one surface of the first substrate and the at leastone surface of the second substrate are each optically-polishedsurfaces.
 8. The organic light emitting diode display of claim 1,wherein the respective surfaces of the first substrate and the secondsubstrate disposed outside of the display area are spaced apart from oneanother.
 9. The organic light emitting diode display of claim 2, whereinthe third groove is further disposed outside of the display area. 10.The organic light emitting diode display of claim 5, wherein the organiclight emitting element comprises: a first surface contacting a bottomsurface of the first groove; and a second surface opposing the firstsurface, wherein the second surface is coplanar with the at least onesurface of the first substrate.
 11. The organic light emitting diodedisplay of claim 1, wherein the organic light emitting element isdisposed completely within the first groove.
 12. The organic lightemitting diode display of claim 2, wherein the second substratecomprises: a fourth groove disposed in association with the firstgroove; a fifth groove disposed in association with the second groove;and a sixth groove disposed in association with the third groove,wherein the organic light emitting element is disposed in each of thefirst and fourth grooves, the sealant is disposed in each of the secondand fifth grooves, and the getter is disposed in each of the third andsixth grooves.
 13. A display device, comprising: a first substratecomprising a first groove disposed in a display area and a second groovedisposed outside of the display area; a light emitting element at leastpartially disposed in the first groove; a sealant at least partiallydisposed in the second groove; and a second substrate disposed on thefirst substrate, wherein the sealant couples the first substrate and thesecond substrate together to seal the light emitting element between thefirst substrate and the second substrate.
 14. The display device ofclaim 13, further comprising: a getter disposed outside the displayarea, wherein the first substrate further comprises a third groovedisposed between the first groove and the second groove, the getterbeing at least partially disposed in the third groove.
 15. The displaydevice of claim 14, wherein the second groove surrounds each of thefirst groove and the third groove.
 16. The display device of claim 15,wherein: the getter surrounds the light emitting element; and thesealant surrounds the getter.
 17. The display device of claim 15,wherein the second substrate comprises: a fourth groove aligned with thefirst groove; a fifth groove aligned with the second groove; and a sixthgroove aligned with the third groove, wherein the light emitting elementis disposed in each of the first and fourth grooves, the sealant isdisposed in each of the second and fifth grooves, and the getter isdisposed in each of the third and sixth grooves.
 18. The display deviceof claim 13, wherein the light emitting element is disposed completelywithin the first groove.
 19. The display device of claim 13, wherein atleast one surface of the first substrate and at least one surface of thesecond substrate are covalently bonded.
 20. The display device of claim19, wherein the at least one surface of the first substrate and the atleast one surface of the second substrate are optically-polishedsurfaces.